Interconnect And Passive Components Market Poised to Reach

Dec 06, 2023

According to a Comprehensive Research Report by Market Research Future (MRFR), Interconnect And Passive Components Market Information By Component Type, Application and Region - Forecast till 2030”, Interconnect And Passive Components Market could thrive at a rate of 6.1% between 2022 and 2030. The market size will be reaching around USD 296,717.3 Million by the end of the year 2030

Interconnect And Passive Components Market Overview

Interconnect and Passive Components are essential electronic components used to establish connections and enable the flow of electrical signals within electronic devices and systems. Interconnect components include connectors, cables, and sockets, while passive components encompass resistors, capacitors, and inductors. They are widely used in various industries such as telecommunications, automotive, consumer electronics, aerospace, and healthcare.

The primary application of interconnect and passive components is to provide reliable and efficient electrical connections. Connectors and cables facilitate the transfer of data, power, and signals between different components and subsystems. Passive components, on the other hand, play crucial roles in circuit design, providing resistance, capacitance, and inductance to control the flow of electricity, filter signals, and store energy.

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Interconnect And Passive Components Market Competitive Landscape:

The affluent companies in the Interconnect And Passive Components industry include

Molex LLC
Panasonic Corporation
Ametek Inc.
Amphenol Corporation
Vishay Intertechnology, Inc.
Murata Manufacturing Co. Ltd.
TDK Corporation
Samsung Electro-Mechanics
Hosiden Corporation
FujitsuTE Connectivity
Hon Hai Precision Industry Co. Ltd.
HIROSE Electric Co. Ltd.
Mouser Electronics, Inc.

Molex LLC, a leading interconnect solutions provider, announced that it had expanded its product portfolio with the launch of high-speed connectors for data centers. This new offering aims to meet the increasing demand for high-speed data transmission and connectivity in data center applications, addressing the market's evolving needs.